Summary The chiplet industry surged with major developments this week. Baya Systems secured $36M to expand its AI and RISC-V chiplet solutions. Arm rel ...

China poised to expand AI infrastructure to keep pace with US Stargate project: Summary China is expected to accelerate digital infrastructure development to bolster its ...

Summary AI is transforming the semiconductor industry, driving 26% of its $600 billion market in 2024. At the AI Executive Conference, leaders highlighted AI's role in boosting manufacturing ...

Summary Samsung unveiled the Galaxy S25, featuring Qualcomm chips and Google’s AI model, aiming to boost sales and outpace Apple and Chinese rivals. With personalized AI features, unchanged prices, ...

Summary High-NA EUV lithography is revolutionizing IC fabrication, enabling sub-2nm nodes with greater feature density but introducing challenges like stitching effects and edge placement errors.

Brewer Science co-CEOs Dan Brewer and Srikanth Kommu highlight the company’s collaborative leadership, focusing on innovation in semiconductor materials. Key areas include high-performance lithography ...

Summary Advancements in heterogeneous integration (HI) are revolutionizing medical device design by enabling smaller, efficient, and durable sensors and MEMS integration. Promex's expertise, backed by ...

Driving Innovation Across Memory Markets Everspin Technologies enters 2025 with a robust roadmap that highlights its ...

MRSI (Mycronic), a US-based industry leader in high-precision chip and die assembly solutions, has encountered challenges due to the US ban on advanced semiconductor production in China. Our expertise ...

2024 was both a challenging year for us and one that pointed the way to the future. The political environment has partly been ...

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

StratEdge has been a leader in the design and production of high-performance semiconductor packages since 1985, with a focus on developing components for compound semiconductors. All our packages are ...