This year’s top semiconductor stories were mostly about the long and twisting trips a technology takes from idea (or even raw ...
Kioxia says it has developed highly stackable oxide-semiconductor channel transistors capable of supporting high-density 3D DRAM. This development could lead to cheaper and faster memory by lowering ...
Taiwan Semiconductor Manufacturing Co. has commenced volume production of its advanced 2-nanometer chips, marking a ...
Metal-Semiconductor Field-Effect Transistors (MESFETs) have long been pivotal in bridging fundamental semiconductor physics with high-performance electronic applications. As devices that combine metal ...
Researchers from the Royal Melbourne Institute of Technology University (RMIT) have developed a proof of concept that is able to pass currents across an air channel rather than silicon. The university ...
Developed core technology that will allow practical implementation of high-density, low-power 3D DRAM, presented at IEEE International Electron Devices Meeting (IEDM) ...
Today’s trend in semiconductor chip manufacturing involves the miniaturizationof transistors and increasing the density of transistors per integrated circuit. Researchers at CU Boulder have developed ...
In a paper published in the journal Nature Electronics, researchers from EPFL’s School of Engineering in the Laboratory of Nanoscale Electronics and Structures (LANES) present a new processor that ...
Here, we report a ferroelectric semiconductor field-effect transistor in which a two-dimensional ferroelectric semiconductor, indium selenide (α-In2Se3), is used as the channel material in the device.
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WEST LAFAYETTE, Ind. – An innovation by Purdue University researchers could help the semiconductor industry design transistors that are smaller, use less power and switch from on to off at smaller ...