Lam Research buys $45.8M office building in Phoenix
Lam Research buys $45.8M office building in Phoenix
4 months ago
ktar.com
Lam Research Entering Earnings Upswing Amid Faster Wafer Fabrication Equipment Spending, BofA Says
Lam Research Entering Earnings Upswing Amid Faster Wafer Fabrication Equipment Spending, BofA Says
3 months ago
marketscreener.com
Step inside of a wafer to see how our tools tackle bonding, dicing, etching, and deposition with the precision needed to shrink gaps, smooth interfaces, and strengthen every layer. The advanced packaging era is here — take a closer look. | Lam Research Corporation
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Step inside of a wafer to see how our tools tackle bonding, dicing, etching, and deposition with the precision needed to shrink gaps, smooth interfaces, and strengthen every layer. The advanced packaging era is here — take a closer look. | Lam Research Corporation
623 views8 months ago
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Dextro™, our new collaborative robot (cobot), is deployed in multiple advanced wafer fabs around the globe. Designed to work alongside fab engineers, Dextro™ transforms how critical maintenance tasks are performed in wafer fabs. By tackling complex, time-consuming jobs with precision and efficiency, discover how Dextro™ plays a key role in the future of semiconductor manufacturing. https://bit.ly/4fgYqDw | Lam Research Corporation
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Dextro™, our new collaborative robot (cobot), is deployed in multiple advanced wafer fabs around the globe. Designed to work alongside fab engineers, Dextro™ transforms how critical maintenance tasks are performed in wafer fabs. By tackling complex, time-consuming jobs with precision and efficiency, discover how Dextro™ plays a key role in the future of semiconductor manufacturing. https://bit.ly/4fgYqDw | Lam Research Corporation
480 viewsDec 10, 2024
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Lam Research launches Coronus DX to facilitate advanced wafer semiconductor manufacturing - BusinessToday
Lam Research launches Coronus DX to facilitate advanced wafer semiconductor manufacturing - BusinessToday
Jun 21, 2023
businesstoday.in
Industry leaders use Aether®, our dry photoresist technology, to tackle the biggest challenges in transferring fine DRAM designs to wafers. Our solution delivers low-defect, high-fidelity precision without compromising cost or sustainability. Read more. https://bit.ly/4aEb5zK | Lam Research Corporation
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Industry leaders use Aether®, our dry photoresist technology, to tackle the biggest challenges in transferring fine DRAM designs to wafers. Our solution delivers low-defect, high-fidelity precision without compromising cost or sustainability. Read more. https://bit.ly/4aEb5zK | Lam Research Corporation
457 viewsJan 29, 2025
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Say hello to the future of conductor etch technology. Akara® builds on decades of innovation, and leverages new proprietary etch solutions to overcome the toughest scaling challenges. Designed for high-volume production, Akara® optimizes wafer output to help chipmakers get more value from their manufacturing equipment. See why leading manufacturers choose Akara® as their production tool for advanced planar DRAM and foundry GAA applications. https://bit.ly/4hZ7Rcu | Lam Research Corporation
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Say hello to the future of conductor etch technology. Akara® builds on decades of innovation, and leverages new proprietary etch solutions to overcome the toughest scaling challenges. Designed for high-volume production, Akara® optimizes wafer output to help chipmakers get more value from their manufacturing equipment. See why leading manufacturers choose Akara® as their production tool for advanced planar DRAM and foundry GAA applications. https://bit.ly/4hZ7Rcu | Lam Research Corporation
564 viewsFeb 19, 2025
FacebookLam Research Corporation
Lam Research Explained 2026 📈 | Semiconductor Manufacturing, Wafer Fab Tech & AI Chips
4 months ago
substack.com
Lam Research : Introduces Advanced Dielectric Gapfill Technology to Enable Next-Generation Devices
Sep 21, 2020
marketscreener.com
Lam Research's Dextro cobot boosts semiconductor production efficiency - The Robot Report
Dec 13, 2024
therobotreport.com
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Plasma etch: where science meets precision. Using plasma, chipmakers can carve microscopic patterns on a wafer. Learn how our plasma etch systems define the pathways that bring advanced technology to life. https://bit.ly/4mji5qd | Lam Research Corporation
325 views7 months ago
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Our cutting-edge advanced packaging technologies make High Bandwidth Memory (HBM) a reality for #GenAI devices. Discover why solutions like 2.5D and 3D integration are critical for enabling the third generation of HBM and providing high-speed access to vast data sets for #AI training. https://bit.ly/47ekrAC | Lam Research Corporation
688 viewsDec 17, 2024
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Advanced packaging is the next wave of semiconductor innovation, meeting the growing demands of AI and enhancing chip performance. Discover how we push the boundaries with our advanced packaging tools and techniques to shape the future of chip design. https://bit.ly/42GBLwW | Lam Research Corporation
379 views7 months ago
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3D NAND structures allow flash memory manufacturers to pack more storage capacity onto a smaller device. Watch this video to see how this innovative process architecture is made. | Lam Research Corporation
22.6K viewsJul 7, 2016
FacebookLam Research Corporation
0:36
Today’s Word of the Week is mask — but not the scary kind! 👻 In chipmaking, a mask isn’t for costumes — it’s a layer that protects specific areas of the wafer during processing. Think of it as a high-tech disguise that gets peeled away to reveal what’s underneath. | Lam Research Corporation
315 views6 months ago
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Building chips this small takes some serious patterning power.⚡ Our advanced patterning tools help print features a few atoms wide with precision that makes “close enough” obsolete. Read our Semi 101 blog post for a breakdown. https://bit.ly/4oVFAYI | Lam Research Corporation
906 views5 months ago
FacebookLam Research Corporation
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The journey of a microchip starts long before it powers your device. To understand this process, it’s important to know the roles of three key players: fabs, fabless companies, and foundries. But how do these pieces fit together? That’s where Lam comes in. Learn how we supply the advanced tools and technology that help fabs, foundries, and fabless companies achieve their goals via the blog. https://bit.ly/3sfI9Md | Lam Research Corporation
485 viewsMay 20, 2025
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What if your tools could think, learn, and adapt? We use digital twins to simulate, predict, and improve every stage of chipmaking, from individual wafers to entire fabs. See how virtual models help us solve complex problems with greater speed, precision, and efficiency via the blog. https://bit.ly/3YqU869 | Lam Research Corporation
253 views11 months ago
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Scaling DRAM demands more than smaller features; it requires new architectures. We provide the process control and material precision to enable 3D stacking, advanced etch profiles, and atomic layer deposition of next-generation materials like molybdenum. Each step moves memory technology beyond its 2D limits and into a new dimensional era. Watch the video for more. | Lam Research Corporation
1K views3 months ago
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1:45
As 3D NAND technology advances, the demand for greater deposition and etch intensity grows. Adding more memory layers requires not only innovative engineering but also precise material deposition and enhanced etch techniques. See how applying stress-compensating materials and leveraging molybdenum for improved conductivity ensure reliable scaling and more in the video below. | Lam Research Corporation
572 viewsMar 25, 2025
FacebookLam Research Corporation
Lam Research unveils two new chipmaking tools for AI chips
Feb 19, 2025
theprint.in
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